Study of microstructural and thermal properties of the Sn-Bi alloys Original scientific paper
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Abstract
Lead-free solders have become a main focus of the electronic industry in recent years, because of the high toxicity of lead. Alloys based on the Sn-Bi system figure as potential replacements for Sn-Pb alloys in soldering due to favorable properties and low cost. One of the main advantages of these alloys are low melting temperatures, while additional advantages include good compatibility with substrates, low process temperature, high reliability, and potential applications in conjunction with reduced graphene oxide nanosheets as thermal interface materials. In this paper, characterization of microstructural and thermal properties as well as hardness measurements of seven alloys of different Sn-Bi compositions are performed. Structural properties of the samples were analyzed using optical microscopy and scanning electron microscopy and energy dispersive X-ray spectroscopy (SEM-EDS). Thermal conductivity of the samples was investigated using the xenon-flash method, and phase transition temperatures were measured using the differential scanning calorimetry (DSC) analysis.
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