Thermal conductivity and microstructure of Bi-Sb alloys Original scientific paper
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Abstract
Four Bi-Sb alloys with compositions Bi79.6Sb20.4, Bi56.9Sb43.1, Bi39.8Sb60.2, Bi18.6Sb81.4 have been investigated regarding the microstructures and thermal properties. The microstructure was examined by scanning electron microscopy with energy-dispersive X-ray spectrometry. The light flash method was applied to determine thermal diffusivity and to obtain thermal conductivity in the temperature range 25 to 150 °Ϲ, while the indirect Archimedean method was used for determination of densities of the investigated Bi-Sb alloys. The obtained results have shown that the density of the studied alloys decreased monotonically with increasing the antimony content. On the other hand, the specific heat capacity of Bi-Sb alloys increased with the increase in the antimony content as well as with increasing the temperature. Thermal diffusivity of the alloys increased slightly with increasing the temperature. Thermal conductivities of the examined Bi-Sb alloys were determined to be in the range of 3.8 to 7 W m-1 K-1, which is lower than thermal conductivities of pure bismuth and antimony. The results obtained in this work represent a contribution to better knowledge of the thermal properties of Bi-Sb alloys, which are of key importance for determining the possibility of their practical application.
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Ministarstvo Prosvete, Nauke i Tehnološkog Razvoja
Grant numbers 451-03-47/2023-01/200131
References
Spinelli JE, Silva BL, Garcia A. Microstructure, phases morphologies and hardness of a Bi–Ag eutectic alloy for high temperature soldering applications. Mater Des. 2014; 58: 338-356. https://doi.org/10.1016/j.matdes.2014.02.026
Song JM, Chuang HY, Wen TX. Thermal and tensile properties of Bi-Ag alloys. Metall Mater Trans A. 2007; 38: 1371-1375. https://doi.org/10.1007/s11661-007-9138-1
Yu M, Matsugi K, Xu Z, Choi Y, Yu J, Motozuka S, Nishimura Y, Suetsugu KI. High temperature characterization of binary and ternary Bi alloys microalloyed with Cu and Ag. Mater Trans. 2018; 59: 303-310. https://doi.org/10.2320/matertrans.MAW201710
Lee H, Choi K-S, Eom Y-S, Bae H-C, Lee JH. Sn58Bi Solder Interconnection for Low‐Temperature Flex‐on‐Flex Bonding. ETRI J. 2016; 38: 1163-1171. https://doi.org/10.4218/etrij.16.0115.0945
Goh Y, Haseeb ASMA, Sabri MFM. Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder. Electrochim Acta. 2013; 90: 265-273. https://doi.org/10.1016/j.electacta.2012.12.036
Manasijević D, Balanović Lj, Marković I, Ćosović V, Gorgievski M, Stamenković U, Božinović K. Thermal transport properties and microstructure of the solid Bi-Cu alloys. Metall Mater Eng. 2022; 28(3): 503-514. https://doi.org/10.30544/841
ASM International Handbook Committee: Properties and selection: nonferrous alloys and special-purpose materials, 2, ASM international, Materials Park, OH, 1990. https://doi.org/10.31399/asm.hb.v02.9781627081627
Okamoto H. Bi-Sb (bismuth-antimony). JPED. 2012; 33: 493-494. https://doi.org/10.1007/s11669-012-0092-2
Rodriguez JE, Cadavid D. Synthesis and thermoelectric properties of polycrystalline Bi-Sb alloys. Rev Fis. 2007; 34: 19-27. https://revistas.unal.edu.co/index.php/momento/article/view/40558
Kitagawa H, Noguchi H, Kiyabu T, Itoh M, Noda Y. Thermoelectric properties of Bi–Sb semiconducting alloys prepared by quenching and annealing. J Phys Chem Solids. 2004; 65(7): 1223-1227. https://doi.org/10.1016/j.jpcs.2004.01.010
Dutta S, Shubha V, Ramesh TG, D'Sa F. Thermal and electronic properties of Bi1− xSbx alloys. J Alloys Compd. 2009; 467(1-2): 305-309. https://doi.org/10.1016/j.jallcom.2007.11.146
Ibrahim AM, Thompson DA. Thermoelectric properties of BiSb alloys. Mater Chem Phys. 1985; 12(1): 29-36. https://doi.org/10.1016/0254-0584(85)90034-3
Yim WM, Amith A. Bi-Sb alloys for magneto-thermoelectric and thermomagnetic cooling. Solid State Electron. 1972; 15: 1141-1165. https://doi.org/10.1016/0038-1101(72)90173-6
Tanuma S. Thermoelectric power of bismuth-antimony alloys. J Phys Soc Jpn. 1961; 16: 2354-2355. https://doi.org/10.1143/JPSJ.16.2354
Touloukian YS, Powell RW, Ho CY, Klemens PG. Thermal Conductivity of Metallic Elements and Alloys. Washington: New York. 1970. http://poplab.stanford.edu/pdfs/Touloukian-v1ThermalConductivityMetallicElementsAlloys-tprc70.pdf
Parker WJ, Jenkins RJ, Butler CP, Abbott GL. Flash Method of Determining Thermal Diffusivity, Heat Capacity, and Thermal Conductivity J Appl Phys. 1961; 32: 1679-1684. https://doi.org/10.1063/1.1728417
Manasijević D, Balanović Lj, Marković I, Gorgievski M, Stamenković U, Božinović K. Microstructure, melting behavior and thermal conductivity of the Sn–Zn alloys Thermochim Acta. 2021; 702: 178978. https://doi.org/10.1016/j.tca.2021.178978
Manasijević D, Balanović Lj, Marković I, Gorgievski M, Stamenković U, Đorđević A, Minić D, Ćosović V. Structural and thermal properties of Sn–Ag alloys Solid State Sci. 2021; 119: 106685. https://doi.org/10.1016/j.solidstatesciences.2021.106685
Božinović KN, Manasijević DM, Balanović LjT, Gorgievski MD, Stamenković US, Marković MS, Mladenović ZD. Study of microstructure, hardness and thermal properties of Sn-Bi alloys/Ispitivanje mikrostrukture, tvrdoce i termijskih karakteristika legura u sistemu Sn-Bi. Hem Ind. 2021; 75(4): 227-240 https://doi.org/10.2298/HEMIND210119021B
Lukas HL, Fries SG, Sundman B. Computational Thermodynamics: the Calphad Method, First edition, Cambridge University Press, Cambridge, 2007. https://doi.org/10.1017/CBO9780511804137
Wang L, Xian AP. Density measurement of Sn-40Pb, Sn-57Bi, and Sn-9Zn by indirect Archimedean method, J Electron Mater. 2005; 34: 1414-1419. https://doi.org/10.1007/s11664-005-0199-x
Kroupa A, Dinsdale AT, Watson A, Vrestal J, Vizdal J, Zemanova A. The development of the COST 531 lead-free solders thermodynamic database JOM. 2007; 59: 20-25. https://doi.org/10.1007/s11837-007-0084-6